LNP THERMOCOMP Lexan_SML5790
應用范圍： 產品描述 LNP THERMOCOMP Lexan_SML5790物性表 Nonhalogenated, 10% glass filled PC. Internal mold release. Thin-wall applications.
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產品描述
LNP THERMOCOMP Lexan_SML5790物性表
Nonhalogenated, 10% glass filled PC. Internal mold release. Thin-wall applications.
來源：http://www.gjhkj.cn/product827948.html
發布時間：2022/5/9 12:03:30
