LNP THERMOCOMP Lexan_SML5897
應用范圍： 產品描述 LNP THERMOCOMP Lexan_SML5897物性表 LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.
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產品描述
LNP THERMOCOMP Lexan_SML5897物性表
LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.
來源：http://www.gjhkj.cn/product827950.html
發布時間：2022/5/9 12:04:39
