LNP THERMOCOMP Lexan_SML5750
應(yīng)用范圍:產(chǎn)品描述LNP THERMOCOMP Lexan_SML5750物性表50% glass bead and filament reinforced. 270F HDT. Will be commercialized as LGB5030N.
下載PDF
詳細(xì)介紹
產(chǎn)品描述
LNP THERMOCOMP Lexan_SML5750物性表
50% glass bead and filament reinforced. 270F HDT. Will be commercialized as LGB5030N.
相關(guān)標(biāo)簽:LNP THERMOCOMP Other,LNP THERMOCOMP Lexan_SML5750,
來源:http://www.gjhkj.cn/product827947.html
發(fā)布時間:2022/5/9 12:02:39