LNP THERMOCOMP Lexan_EXCP0011
應(yīng)用范圍： 產(chǎn)品描述 LNP THERMOCOMP Lexan_EXCP0011SF008物性表 LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<
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產(chǎn)品描述
LNP THERMOCOMP Lexan_EXCP0011SF008物性表
LNP* Thermocomp* Lexan_EXCP0011 compound is a 15% carbon fiber filled PC injection moulding resin. Material identification acc. ISO11469: >PC-CF15<
相關(guān)標(biāo)簽：LNP THERMOCOMP Other,LNP THERMOCOMP Lexan_EXCP0011,
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發(fā)布時(shí)間：2022/5/9 11:39:49
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