LNP THERMOCOMP Lexan_EXCP0008
應用范圍： 產品描述 LNP THERMOCOMP Lexan_EXCP0008物性表 LNP* Thermocomp* Lexan_EXCP0008 compound is a 20% glass beads filled PC injection moulding resin
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產品描述
LNP THERMOCOMP Lexan_EXCP0008物性表
LNP* Thermocomp* Lexan_EXCP0008 compound is a 20% glass beads filled PC injection moulding resin
來源：http://www.gjhkj.cn/product827910.html
發布時間：2022/5/9 11:39:44
上一個：LEXAN PC FXM911A
